Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Thu Jul 09 17:05:22 EDT 1998 | Dave F
| I am looking for some guidelines on evaluating solder paste. I am specifically interested in No-Clean Pastes, as they are a completely new ball game when it comes to slump, tack time, stencil life, tack time, etc. | Thanks for any and all help give
Electronics Forum | Sun Mar 24 23:11:36 EST 2002 | sy_koh
I am looking technology for BCC package. The preliminary datasheet from customer show that it had rectangular flat pad on the joint. The smallest pitch is 0.6mm having 96 I/Os. I am currently putting BGA, uBGA, CSP and CBGA onto PCBs usinf no-clean
Electronics Forum | Wed Jul 17 12:07:48 EDT 2002 | dragonslayr
DaveF is correct in directing you to the archives. This problem type has been discussed many times, it is quite common. Questions to ask yourself and provide us with answers are: It always happens or random? All assemblies or just one? solder paste
Electronics Forum | Tue Mar 18 09:11:14 EST 2003 | Rob C
With a standard valve and no-clean solder paste you may get a few good dots. But, repeatability will be terrible too many variable, air-pressure, board height (two post nozzle), valve time on/off, retract height, retract time, etc... A RMA paste wi
Electronics Forum | Mon Dec 22 19:53:11 EST 2003 | Dean
Digital camera's are worth their weight in gold! Foremost it's a health and safety issue. That alone should compel the management team to get with the program. As an Engineer I have to know how to operate, program, maintain, troubleshoot and CLEAN
Electronics Forum | Fri Jun 25 09:19:12 EDT 2004 | tjensen
60-70% RH will be a challenge if you are running a water wash solder paste (and could be the reason you are seeing the problems). If you are running a no-clean, humidity should not be an issue. As long as the profile looks OK, I don't think the con
Electronics Forum | Mon Jun 28 10:17:44 EDT 2004 | davef
People like flat surfaces for placing and reflowing certain components, like fine pitch devices. Some board suppliers can supply HASL that is flat and well controlled from an amount of material stand-point. Unlike OSP, HASL has a wonderful shelf-li
Electronics Forum | Mon Sep 19 08:36:53 EDT 2005 | lloyd
I had a similar problem a few years ago when glue printing. Our production environment wasn't to clean room standards and there was a bit of air born contamination floating around which would gather on the PCB surface (also our rough board edges wou
Electronics Forum | Fri Sep 30 19:14:35 EDT 2005 | DasonC
The stencil is 5 mil thick and the aperture is 12 mil sq. We found open but can't detect by x-ray. The process which we are using is no clean TIN/LEAD. Just thinking the ball size variance from 0.35~0.45mm per IPC-7095, in worst case scenarios, th
